Direct to Chip Cooling

As the trend towards cloud computing is skyrocketing and demand is increasing for products and services enabled by Artificial Intelligence (AI), High Performance Computing (HPC) and the Internet of Things (IoT), the number of large, centralised data centres worldwide is also growing.

The demand for greater computing power delivered by these data centres is also increasing, using ever more powerful new chips generate more heat, and server systems that pack multiple numbers of these chips into a single chassis.

Direct Liquid Cooling (DLC) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling to targeted areas. By using DLC and warm water, the dependence on fans and expensive air handling systems is drastically reduced.

This results in much higher rack density, overall reduced power use and significantly higher performance potential.

Key Features
  • Reduced energy. Compared to traditional air cooling, liquid cooling is more efficient at transferring heat away from electrical components.
  • Increased processing capacity. Because direct to chip liquid cooling is precisely targeted, and therefore more effective in isolating and dissipating heat, equipment is able to support greater CPU and GPU densities
  • Reduced space. Rack-based liquid cooling solutions keep cooling inside the enclosures, reducing the need for additional heat removal systems
  • Reduced downtime. Because it is more effective in removing heat, chip-level cooling means less likelihood of equipment overheating, a major cause of data centre downtime