As the trend towards cloud computing is skyrocketing and demand is increasing for products and services enabled by Artificial Intelligence (AI), High Performance Computing (HPC) and the Internet of Things (IoT), the number of large, centralised data centres worldwide is also growing.
The demand for greater computing power delivered by these data centres is also increasing, using ever more powerful new chips generate more heat, and server systems that pack multiple numbers of these chips into a single chassis.
Direct Liquid Cooling (DLC) uses the exceptional thermal conductivity of liquid to provide dense, concentrated cooling to targeted areas. By using DLC and warm water, the dependence on fans and expensive air handling systems is drastically reduced.
This results in much higher rack density, overall reduced power use and significantly higher performance potential.